Title:
MANUFACTURE OF PRINTED-WIRING BOARD
Document Type and Number:
Japanese Patent JPH04261095
Kind Code:
A
Abstract:
PURPOSE: To manufacture a highly reliable printed-wiring board by a method wherein in the case the printed-wiring board is manufactured by a partly additive method, the adhesiveness of a photoresist to a circuit pattern is improved.
CONSTITUTION: In the case a printed-wiring board is manufactured from a copper-clad laminated board by a partly additive method, a metal layer, which has a superior adhesiveness to a resin layer and is a layer other than a copper layer, is formed on the surface of the copper-clad laminated board and thereafter, a circuit pattern is formed, then, a photoresist having a resistance is attached on a copper plating solution.
Inventors:
KUBOTA SHIGERU
HIZUKA YUJI
TANAKA SACHIKO
ARAI HITOSHI
HIZUKA YUJI
TANAKA SACHIKO
ARAI HITOSHI
Application Number:
JP918791A
Publication Date:
September 17, 1992
Filing Date:
January 29, 1991
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H05K3/42; (IPC1-7): H05K3/42
Attorney, Agent or Firm:
Mamoru Takada (1 person outside)
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