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Title:
MANUFACTURE OF RESIN-SEALED TYPE SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP3736207
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a manufacturing method for a resin-sealed type semiconductor device where high reliability is assured for product insulating characteristics and for heat dispersion.
SOLUTION: This resin-sealed type semiconductor device comprises a metal frame 2, where a power element is mounted, a metal heat-radiating plate 5 counter to the rear surface of the metal frame 2 with an insulating layer 4 inbetween, and a mold resin 6 which seals the perimeter of members while the rear surface of the heat-radiating plate 5 is exposed. Here, prior to the formation of the insulating layer 4 and attaching of the heat-radiating plate, a mold resin is molded at the perimeter of the metal frame 2 except at a recessed space 6a, where the rear surface of the metal frame 2 with the mounted power element 1 being exposed, then an insulating layer is formed at the metal frame which is exposed in the recessed space, to which the heat-radiating plate 5 is bonded. So, no mechanical or thermal stress which causes crackings or peelings is applied on the insulating layer 4 at mold resin molding, for improved insulating characteristics and heat radiation characteristics.


Inventors:
山田 昭治
前田 孝夫
Application Number:
JP1999000159006
Publication Date:
January 18, 2006
Filing Date:
June 07, 1999
Export Citation:
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Assignee:
富士電機デバイステクノロジー株式会社
International Classes:
H01L23/29; (IPC1-7): H01L23/29
Domestic Patent References:
JP6085110A
JP7231069A
JP9008209A
JP7086472A
JP5036863A
JP50001377B1
Attorney, Agent or Firm:
篠部 正治