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Title:
MANUFACTURING METHOD FOR JOINT BODY, MANUFACTURING METHOD FOR MEMS DEVICE, MANUFACTURING METHOD FOR LIQUID INJECTION HEAD, AND MANUFACTURING APPARATUS FOR JOINT BODY
Document Type and Number:
Japanese Patent JP2018030362
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a manufacturing method for a joint body capable of inhibiting an adhesion failure from occurring in the joint body by more reliably detecting application unevenness of adhesive in a configuration in which a plurality of structures are joined by the adhesive so as to form the joint body, and a manufacturing method for an MEMS device, a manufacturing method for a liquid injection head and a manufacturing apparatus for the joint body.SOLUTION: A manufacturing method for a joint body in which a plurality of structures in a state of being laminated are joined with one another by adhesive 21, includes: an adhesive layer formation step of forming an adhesive layer 30 on one surface of a transfer film 33 serving as a medium; a viscosity adjustment step of adjusting viscosity of the adhesive layer 30 formed in the adhesive layer formation step; and a transfer step of transferring the adhesive layer 30 whose viscosity is adjusted in the viscosity adjustment step to the structures. In a stage prior to the transfer step, a surface roughness measurement step of measuring surface roughness of the adhesive layer 30 on the transfer film 33 is performed.SELECTED DRAWING: Figure 4

Inventors:
TSUCHIYA HIROYUKI
Application Number:
JP2016246277A
Publication Date:
March 01, 2018
Filing Date:
December 20, 2016
Export Citation:
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Assignee:
SEIKO EPSON CORP
International Classes:
B41J2/16
Attorney, Agent or Firm:
Kazuaki Watanabe
Keisuke Nishida
Satoshi Nakai