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Title:
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2019079966
Kind Code:
A
Abstract:
To provide a technique for suppressing formation of air bubbles in the vicinity of a semiconductor element without significantly reducing the heat dissipation of a semiconductor device.SOLUTION: A manufacturing method of a semiconductor device according to the present invention includes a step of preparing a laminate having a semiconductor element and a conductor member joined to the semiconductor element and a step of placing the laminate in a mold and injecting a resin into the mold to seal the laminate with the resin. The conductor member is formed with a hole or a groove having an opening on the circumferential side extending in the laminating direction of the laminate. In the sealing step, the laminate is placed in the mold such that the opening of the hole or groove of the conductor member is positioned at the junction planned location of the resin rolled back from two directions of the laminate and merged.SELECTED DRAWING: Figure 2

Inventors:
IMAI HIROMICHI
MIYAZAKI TOSHIHIRO
Application Number:
JP2017206654A
Publication Date:
May 23, 2019
Filing Date:
October 25, 2017
Export Citation:
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Assignee:
TOYOTA MOTOR CORP
International Classes:
H01L21/56; H01L23/28; H01L23/36
Domestic Patent References:
JP2010267850A2010-11-25
JP2015126057A2015-07-06
JP2016134591A2016-07-25
Attorney, Agent or Firm:
Kaiyu International Patent Office