To provide a manufacturing method of a surface emitting semiconductor light-emitting element, a surface emitting semiconductor light-emitting element and a mounting method of the same, and a bonded wafer for a surface emitting semiconductor light-emitting element, which can more efficiently radiate heat generated in an active layer.

A manufacturing method of a surface emitting semiconductor light-emitting element comprises: a process of epitaxially growing a plurality of compound semiconductor layers including an active layer on a first support substrate; a process of forming an upper electrode on the plurality of epitaxially-grown compound semiconductor layers; a process of bonding a second support substrate on the upper electrode via a joint metal layer; a process of removing the first support substrate by etching; a process of forming a lower electrode at a part from which the first support substrate is removed by etching; and a process of removing the second support substrate.