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Patent Searching and Data


Title:
METAL LID FOR HERMETICALLY SEALING SEMICONDUCTOR PACKAGE
Document Type and Number:
Japanese Patent JPH10247696
Kind Code:
A
Abstract:

To realize a metal lid which is easily handled and capable of sealing up a semiconductor package without inducing voids in a solder layer, leaving flux residues, and generating solder balls by a method wherein a solder clad metal plate composed of a solder-clad metal plate provided on its one side is used for sealing a semiconductor package.

A package base 1 is formed of ceramic material and provided with a recess 3, wherein a semiconductor device is mounted in the recess 3. The ceramic package base 1 is poor in solderability, so that a lid 5 is bonded to the base 1 surrounding a part of the base 1 to seal up with solder or the recess 3 to form a sealed part. The lid 5 is formed like a plate and of a solder- clad metal plate composed of a solder-clad metal plate deposited on its one side, and the solder clad is Pb alloy, composed of 2 to 15wt.% of Bi, 2 to 6wt.% of Sn, 0.5 to 2wt.% of In, 0.5 to 2wt.% of Ag, and a residual wt.% of Pb, and has a solidifying temperature range of 240 to 310°C. Solder is prevented from flying away, so that no solder ball is attached to the inner side of a package.


Inventors:
YAMAMOTO TETSUYA
KAWAMURA SHIGEKI
TANIGUCHI SANAE
Application Number:
JP4922597A
Publication Date:
September 14, 1998
Filing Date:
March 04, 1997
Export Citation:
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Assignee:
SUMITOMO KINZOKU ELECTRO
SENJU METAL INDUSTRY CO
International Classes:
B23K35/22; B23K35/26; B32B15/01; C22C11/06; C22C11/08; C22C11/10; H01L23/02; H01L23/04; H01L23/10; (IPC1-7): H01L23/02; B23K35/22; B23K35/26; C22C11/08; H01L23/04
Attorney, Agent or Firm:
広瀬 章一