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Patent Searching and Data


Title:
METALLIC COMPOSITE SHEET AND LAMINATE FOR CIRCUIT BOARD USING THE SHEET
Document Type and Number:
Japanese Patent JP2002241989
Kind Code:
A
Abstract:

To provide a metallic composite sheet which has high peeling strength with a resin material, and is effective when used for producing a circuit board.

Metallic foil 1 is used as a core sheet, and at least one plating layer 2 consisting of an aggregated structure of fine crystal grains is formed on one side or both sides of the metallic foil 1. Further, fine grains 3 having the average grain size of ≤1 μm are deposited on the surface of the plating layer 2 by electroplating.


Inventors:
SUZUKI AKITOSHI
FUKUDA SHIN
HOSHINO KAZUHIRO
ASHIZAWA KOICHI
Application Number:
JP2001000361160
Publication Date:
August 28, 2002
Filing Date:
November 27, 2001
Export Citation:
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Assignee:
FURUKAWA CIRCUIT FOIL KK
NIPPON FOIL MFG
International Classes:
H05K1/09; B32B15/01; C25D5/10; C25D7/00; C25D7/06; H05K3/00; H05K3/38; (IPC1-7): C25D7/00; B32B15/01; C25D5/10; C25D7/06; H05K1/09; H05K3/00; H05K3/38
Attorney, Agent or Firm:
長門 侃二