Title:
METHOD AND APPARATUS FOR FABRICATING SUPERCONDUCTIVE WIRE BY BONDING SUPERCONDUCTIVE FILAMENT
Document Type and Number:
Japanese Patent JPH04262309
Kind Code:
A
Abstract:
PURPOSE: To manufacture a flexible superconducting wire effectively in cost by assembling a plurality of superconducting filaments each coated with silver with a supporting base plate, and fixing with solder. CONSTITUTION: A superconducting filament 20 is continuously drawn out of each supply spool 16 and guided to a coupling plate 14 through a guide tube 22. Each groove 32 guides the filament 20 and forms a filament layer 42 by matching the filaments 40. A supporting base plate 44 positions the layer 42 drawn out of a supporting base plate spool 46, in a channel. Solder paste 86 is supplied in the lower part of a distributor 84, suitably heated in a furnace 88, and the layer 42 is soldered to the supporting base plate 44. The remaining flux is removed during stretching of the layers through a scrubber 130, and a shroud is wound in a winding spool 26 with a shroud distributor 106.
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Inventors:
MAIKURU BUI FUITSUSHIYAA
KURUTO EMU SHIYAUBERU
ROORENSU DEII UURUFU
ROBAATO EI ORUSUTATSUDO
UIRIAMU EI RATSUJIO
KURUTO EMU SHIYAUBERU
ROORENSU DEII UURUFU
ROBAATO EI ORUSUTATSUDO
UIRIAMU EI RATSUJIO
Application Number:
JP24354991A
Publication Date:
September 17, 1992
Filing Date:
September 24, 1991
Export Citation:
Assignee:
GEN ATOMIC CO
International Classes:
C04B37/02; H01B12/10; H01B13/00; H01L39/14; H01L39/24; (IPC1-7): C04B37/02; H01B12/10; H01B13/00
Attorney, Agent or Firm:
Akira Asamura (3 outside)