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Title:
METHOD AND APPARATUS FOR MANUFACTURING EMBOSSING DIE
Document Type and Number:
Japanese Patent JP2013223874
Kind Code:
A
Abstract:

To provide a method and an apparatus for manufacturing an embossing die that can efficiently and inexpensively form a die for carrying out embossing of braille or the like.

An apparatus for manufacturing an embossing die includes a male punch 64a for plastically deforming a part of a die forming metal plate 31 composing a male die 30a, and a female punch 64b for punching out the other die forming metal plate 31 composing a female die 30b. The apparatus also includes slide rails 36, 44 and slider driving devices 42, 48 for successively changing the relative positions of the male punch 64a and female punch 64b to the die forming metal plates 31. The apparatus further includes a press driving part 50 for driving the male punch 64a and the female punch 64b, and mounting plates 23, 24 for fixing a pair of die forming metal plates 31. The positions of the pair of die forming metal plates 23, 24 deviate from each other by a distance equal to a space between the mounting positions of the male punch 64a and female punch 64b.


Inventors:
YANASE TETSUO
YANASE YOSHITAKA
Application Number:
JP2012097581A
Publication Date:
October 31, 2013
Filing Date:
April 23, 2012
Export Citation:
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Assignee:
FRONTIER KK
International Classes:
B21D37/20; B21D22/02; B21D28/00; B29C33/38; B29C59/02; G09B21/02
Domestic Patent References:
JPH11277161A1999-10-12
JP2012020499A2012-02-02
JPH10329212A1998-12-15
JP2012020499A2012-02-02
JPH10329212A1998-12-15
JPH11277161A1999-10-12
Attorney, Agent or Firm:
廣澤 勲