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Title:
METHOD AND APPARATUS FOR OPTICALLY MOLDING
Document Type and Number:
Japanese Patent JP2001225391
Kind Code:
A
Abstract:

To shorten a molding time by enhancing a molding accuracy in a laminating direction and preventing a curing deformation of a resin model to be obtained while enhancing interlayer adhesive properties.

A method for optically molding obtains a stereoscopic resin model W by the steps of scanning a light beam LB on a surface of a photosetting resin liquid 1 and sequentially laminating cured scanned cured layers 6. In this case, in order to scan the beam and to cure the resin, a curing depth D of a region to be cured by depositing on a region 51 cured by previous time scanning is set larger than that of a region cured by deposited on a region 52 not cured by the previous time curing. A scanning phase of the region cured by the previous time scanning and a scanning phase of the region cured by this time scanning are relatively deviated.


Inventors:
ASANO JUNICHI
Application Number:
JP2001018209A
Publication Date:
August 21, 2001
Filing Date:
November 18, 1992
Export Citation:
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Assignee:
SONY CORP
International Classes:
B29C67/00; (IPC1-7): B29C67/00
Domestic Patent References:
JPH02113925A1990-04-26
JPH05169551A1993-07-09
JPH0671761A1994-03-15
JPH04169222A1992-06-17
JPH05154924A1993-06-22
Foreign References:
WO1991006378A11991-05-16
Attorney, Agent or Firm:
Takahisa Sato