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Patent Searching and Data


Title:
METHOD AND APPARATUS FOR TREATING SUBSTRATE
Document Type and Number:
Japanese Patent JP2008183559
Kind Code:
A
Abstract:

To homogeneously and rapidly carry out the control work to improve the removal condition of a treating film of a coating film or the like.

An apparatus for treating a substrate has a removing liquid discharge nozzle 56 discharging the removing liquid to the treating film formed on the outer peripheral part of a wafer W and a fixing block 100 for fixing the removing liquid discharge nozzle 56. The fixing block 100 is provided with a groove for being engaged with the removing liquid discharge nozzle 56 and fixing the removing liquid discharge nozzle 56 toward the prescribed depression angle direction and the plurality of grooves is provided in every fixed angle.


Inventors:
NAGASHIMA SHINJI
KAWABUCHI YOSUKE
IDE HIROYUKI
Application Number:
JP2008000102305
Publication Date:
August 14, 2008
Filing Date:
April 10, 2008
Export Citation:
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Assignee:
TOKYO ELECTRON LTD
International Classes:
B05D3/12; B05C11/00; B05C11/10
Domestic Patent References:
JPH04263429A1992-09-18
JPH11102854A1999-04-13
JPH09260277A1997-10-03
JPH08195370A1996-07-30
JPH0817817A1996-01-19
JPH09220505A1997-08-26
JP2002184751A2002-06-28
JPH11176734A1999-07-02
JP2000082646A2000-03-21
Attorney, Agent or Firm:
金本 哲男
亀谷 美明
萩原 康司