Title:
METHOD FOR ATTACHING ELECTRONIC ASSEMBLY TO BOTTOM OVERLAY IN MANUFACTURE OF ELECTRONIC DEVICE
Document Type and Number:
Japanese Patent JP2016215652
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method for adhering an electronic assembly to a bottom cover sheet in the manufacture of an electronic device.SOLUTION: This invention relates to a method for attaching an electronic assembly to a bottom overlay in the manufacture of an electronic device, comprising the steps of: providing a bottom overlay that has a top surface and a bottom surface; applying a unique modified UV curable adhesive directly to the top of the bottom overlay; processing the bottom overlay having the applied unique modified UV curable adhesive through an ultraviolet light system to activate the unique modified UV curable adhesive; and affixing the electronic assembly directly to the top of the activated unique modified UV curable adhesive. A method for manufacturing an electronic device including the attaching method is also provided.SELECTED DRAWING: Figure 3
Inventors:
ROBERT SINGLETON
Application Number:
JP2016153329A
Publication Date:
December 22, 2016
Filing Date:
August 04, 2016
Export Citation:
Assignee:
INNOVATIER INC
International Classes:
B29C45/14; B29C45/26; B29C65/52; B29C69/02
Domestic Patent References:
| JP2000017242A | 2000-01-18 | |||
| JP2009541993A | 2009-11-26 |
Attorney, Agent or Firm:
Hatsushi Shimizu
Masao Haruna
Hirotaka Yamaguchi
Toshi Gobe
Ryuichi Inoue
Toshimitsu Sato
Koichi Niimi
Tomohiko Kobayashi
Masato Ozeki
Yoshihiro Igarashi
Kazuya Kawamoto
Masao Haruna
Hirotaka Yamaguchi
Toshi Gobe
Ryuichi Inoue
Toshimitsu Sato
Koichi Niimi
Tomohiko Kobayashi
Masato Ozeki
Yoshihiro Igarashi
Kazuya Kawamoto
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