To provide a method for cutting a cylindrical workpiece which can restrict a relative oscillation between a wire and the cylindrical workpiece and can prevent cracks of a wafer; and a holding tool for use therein.

This method for cutting a cylindrical workpiece can restrict abruptly an increase in cutting resistance to be generated at the time of simultaneous cutting start of the cylindrical workpiece 1 and a holding tool 10. The holding tool 10 comprises a recess 12 in correspondence to a curved face profile of the cylindrical workpiece 1 for fixing the cylindrical workpiece 1 by use of adhesives; and edges 14a, 14b provided at both ends of the recess 12 for receiving adhesives overflowed from the recess 12, and the edges 14a, 14b are provided with a cutting end point (E-E) and forward of a wire of the recess 12.