Title:
METHOD FOR CUTTING SINGLE CRYSTAL INGOT BY WIRE SAW
Document Type and Number:
Japanese Patent JP2004268508
Kind Code:
A
Abstract:
To provide a method for cutting a single crystal ingot by a wire saw in which the efficiency of face matching work is good and the precision of face matching is high when the single crystal ingot is cut in parallel with the end surface of the ingot.
In the method for cutting the single crystal ingot by the wire saw, the single crystal ingot 32 mounted/fixed on/to a swivel table 31 is cut in parallel with the ingot end surface 32a by using the wire saw 33. The inclination of the ingot end surface 32a is detected/measured by laser displacement sensors 11-13, and the inclination angle of the end surface 32a is calculated. The inclination of the end surface 32a is corrected on the basis of the inclination angle.
Inventors:
NARITA YOSHIHIRO
TERUNUMA KOYU
MORI MASAMI
MASUYAMA SHOJI
WATANABE NOBUFUMI
HORIGUCHI TADASHI
TERUNUMA KOYU
MORI MASAMI
MASUYAMA SHOJI
WATANABE NOBUFUMI
HORIGUCHI TADASHI
Application Number:
JP2003065111A
Publication Date:
September 30, 2004
Filing Date:
March 11, 2003
Export Citation:
Assignee:
HITACHI CABLE
International Classes:
G01B11/26; B24B27/06; B28D5/04; C30B33/00; H01L21/304; (IPC1-7): B28D5/04; B24B27/06; C30B33/00; G01B11/26; H01L21/304
Attorney, Agent or Firm:
Nobuo Kinutani
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