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Patent Searching and Data


Title:
METHOD AND DEVICE FOR CUTTING OFF PLURALITY OF PLATES FROM HARD AND FRAGIL WORKPIECE
Document Type and Number:
Japanese Patent JP2000117613
Kind Code:
A
Abstract:

To obtain high cutting capacity, a short processing time, and impoved cutting surface quality in particular.

In this device, a workpiece is moved at a given feeding speed to cut off plural or many plates by the wire frame 1 of a wire saw from a hard and fragil workpiece 2. In this case, the frame 1 is formed of a saw wire 3 covered by joined cutting particles to reciprocatively move the wire 3, and a cooling medium 6 is supplied to the lower side of the frame 1 to dip the wire 3 of the frame 1 into the medium 6 in cutting off the plates.


Inventors:
HUBER ANTON
JUNGE JOACHIM
MOSER JOERG
Application Number:
JP1999000257919
Publication Date:
April 25, 2000
Filing Date:
September 10, 1999
Export Citation:
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Assignee:
WACKER SILTRONIC HALBLEITERMAT
International Classes:
B24B27/06; B23D57/00; B28D5/00; B28D5/04; B65H54/30; H01L21/304; (IPC1-7): B24B27/06; B28D5/04
Attorney, Agent or Firm:
Toshio Yano (3 outside)