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Title:
METHOD AND DEVICE FOR POLISHING SUBSTRATE WHILE USING OPTICAL POLISHING-ENDPOINT DETECTING DEVICE
Document Type and Number:
Japanese Patent JP2010284749
Kind Code:
A
Abstract:

To provide a polishing method and a polishing device that are suitably used for specifying the cause of photo-corrosion.

The polishing method is carried out as follows. Polishing liquid is supplied onto a polishing pad 22. A substrate W and the polishing pad 22 are brought into sliding contact with each other under the presence of the polishing liquid so as to polish the substrate W. During the polishing of the substrate W, light is irradiated onto the surface of the substrate W while light reflected from the substrate W is received so as to decompose the reflected light in accordance with the wavelength and to measure the intensity of the reflected light over a prescribed wavelength range. The progress of polishing of the substrate W is monitored on the basis of the intensity of the reflected light at least in one prescribed wavelength. The polishing conditions include the time of light irradiation to the substrate W, the intensity of the reflected light in each wavelength within the prescribed wavelength range, and the prescribed wavelength range. The polishing conditions are associated with the time and date when the substrate W is polished so as to store them in a storage device 50.


Inventors:
KANEUMA TOSHIFUMI
Application Number:
JP2009000140079
Publication Date:
December 24, 2010
Filing Date:
June 11, 2009
Export Citation:
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Assignee:
EBARA CORP
International Classes:
B24B37/013; B24B49/04; B24B49/12; H01L21/304
Attorney, Agent or Firm:
渡邉 勇
小杉 良二
廣澤 哲也