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Patent Searching and Data


Title:
METHOD AND DEVICE FOR RESIN MOLDING USING LIQUID RESIN
Document Type and Number:
Japanese Patent JPH10305438
Kind Code:
A
Abstract:

To carry out the resin molding using liquid resin easily and securely.

In a resin molding method, a parting face including a pot 10 of a resin molding die is coated with a release film 30 and products 50 to be molded are clamped through the release film, and resin is filled from the pot 10 into cavities to carry out the resin molding. In that case, a storage recessed section 30a for sucking the release film 30 by air from the inside of the pot 10 and storing the resin in the pot 10 is formed, and liquid resin 12 of the given amount is fed into the storage recessed section 30a by using a dispenser 60, and the liquid resin 12 stored in the storage recessed section 30a is extruded from the inside of the pot 10 into the cavities 14 by air pressure only.


Inventors:
MIYAJIMA FUMIO
Application Number:
JP11391897A
Publication Date:
November 17, 1998
Filing Date:
May 01, 1997
Export Citation:
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Assignee:
APIC YAMADA KK
International Classes:
B29C33/18; B29C33/68; B29C45/02; B29C45/14; B29C45/34; B29C45/73; H01L21/56; B29K101/10; B29L31/34; (IPC1-7): B29C33/18; B29C33/68; B29C45/02; B29C45/14; B29C45/34; B29C45/73; H01L21/56
Attorney, Agent or Firm:
Takao Watanuki (1 outside)