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Patent Searching and Data


Title:
METHOD FOR FABRICATING MOLD ELECTRONIC DEVICE PART
Document Type and Number:
Japanese Patent JPH08252830
Kind Code:
A
Abstract:

To provide a mold and a mold insert for producing a mold polymer element having a highly accurate fine part by arranging the mold insert in the mold and introducing a polymer material in a molten or unsolidified state so as to contact the same with the mold.

An etchable layer 20 is etched to form a depression 25. Etching is performed by lightly immersing the etchable layer in an etching soln. After etching is completed, a mask layer 30 is removed to form a mold insert which is, in turn, used in order to mold a polymer element. The mold insert is arranged on a mold and, when a polymer resin is introduced into the mold in a flowing state (e.g. a solution state, a molten state or an unsolidified state), the depression 25 is filled with the resin in the flowing state. This resin is cured (e.g. the evaporation of a solvent, cooling or solidification) to form the polymer element having a desired fine part.


Inventors:
KEN MASHIYUU TAKAHASHI
Application Number:
JP1995000335703
Publication Date:
October 01, 1996
Filing Date:
December 01, 1995
Export Citation:
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Assignee:
AT & T CORP
International Classes:
G02B5/02; B29C33/42; B29C39/02; B29C39/26; G02F1/1335; G02F1/1339; B29C33/38; G02F1/1333; (IPC1-7): B29C39/26; B29C39/02; G02B5/02; G02F1/1335
Attorney, Agent or Firm:
三俣 弘文