To provide a method of forming a resist pattern for plating which can easily peel a resist without giving damage and an influence on a substrate and metal elements on the same substrate, and to provide a photomask used for the same method.

In the method of forming a resist pattern for plating with a photosensitive resist on a substrate and peeling the resist pattern after the plating, an aperture pattern 9 for plating and a dummy pattern 10 for peeling the film are provided to the resist. Moreover, the resolution depth of the dummy pattern 10 for peeling the film is equal to the thickness of the resist layer 3 or less, and an aperture pattern 6 for plating and a dummy pattern 7 for peeling the film are also provided to a photomask 4 for use.