To provide a method of manufacturing circuit board using an adhesive tape in which a circuit pattern is uniformly embedded in a board and the surface thereof is flat.
The method of manufacturing circuit board utilizes an adhesive tape and comprises steps of (A) forming a circuit pattern on an adhesive agent layer of the adhesive tape by a conductor, (B) forming an insulated layer by coating the circuit forming surface of the adhesive tape with an insulation material, and then (C) exposing the circuit at the surface of insulation layer by peeling the adhesive tape. In this manufacturing method, the adhesive tape is desirably formed as an adhesive tape for fixing a circuit board characterized in that the adhesive agent layer is provided to the single surface or both surfaces of a basic material, and the adhesive agent layer is formed by bridging over an acrylic copolymer in which an SP value is in a range from 17.4 (J/cm3)1/2 to 21.5 (J/cm3)1/2 in order to result in a gel-volume rate of 70 wt.% or more with the bridging agent.
MURATA SHUTO
TAKANO HITOSHI
SATO MASAAKI
SHIMOKAWA DAISUKE
