To provide a method of manufacturing an electrooptical apparatus, an apparatus for manufacturing the electrooptical apparatus, an adhesive, and a method of manufacturing a mounting structure by which the reliability of connection is enhanced by preventing resin biting between a terminal of a member to be connected and a terminal of a substrate.
The method comprises the process steps of; aligning a non-conductive film (NCF) 25 and the substrate 4 so that a concave sections 60 and 61 provided on the NCF 25 and substrate side input/output terminals 11a and 14a may correspond; sticking the NCF 25 to the substrate 4; aligning a driver IC 17 etc. so that driver side input/output terminals 23 and 24 and the concave sections 60 and 61 may correspond; and sticking the driver IC 17 etc. by pressure to the substrate 4 via the NCF 25. By decreasing an amount of the NCF 25 between the driver side input/output terminals 23 and 24, and substrate side input/output terminals 11a and 14a before sticking by pressure, the resin biting is prevented between the driver side input/output terminals 23 and 24, and substrate side input/output terminals 11a and 14a after sticking by pressure, and connection reliability is enhanced.
SUGIYAMA KAZUHIRO
Fujitsuna Hideyoshi
Osamu Suzawa