Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
METHOD OF MANUFACTURING FLAT CONDUCTOR
Document Type and Number:
Japanese Patent JP2019003763
Kind Code:
A
Abstract:
To provide a method of manufacturing flat conductor improving a yield in comparison to a prior manufacturing method, dispensing with increase of a board thickness and superposition for securing a conductor sectional area, and capable of inexpensively producing a flat conductor.SOLUTION: The method of manufacturing a flat conductor includes: a metal plate-forming process of forming a rectangular metal plate 11 having an even thickness; a mold-clamping process of abutting a second metal mold 17 which covers an upset groove to a first metal mold 15 having a groove end opening 19 having a sectional shape same as that of the metal plate 11 on a front face 21, and formed with the upset groove having an enlarged part on an orthogonal plane adjacent to a front face 21; a metal plate-holding process of holding a base end side of the metal plate 11 with a pair of hold fixing dies 13 while leaving an insertion tip end which is longer than a distance from the groove end opening 19 to a groove end edge; a metal plate-enlarging process of broadening a width direction of the metal plate 11 following the enlarged part by inserting the metal plate 11 from an insertion tip end into the groove end opening 19 to press against a groove end edge, and thereafter further pressing in; and a releasing process of taking out a molded metal plate from the first metal mold 15.SELECTED DRAWING: Figure 1

Inventors:
YANAGIHARA SHINICHI
HISHIKURA SATOSHI
Application Number:
JP2017115849A
Publication Date:
January 10, 2019
Filing Date:
June 13, 2017
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
YAZAKI CORP
International Classes:
H01B13/00; B21J5/08; H01B5/02; H01M2/20; H01R43/16
Attorney, Agent or Firm:
Patent business corporation glory patent office