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Title:
METHOD FOR MANUFACTURING HOLLOW DEVICE, HOLLOW DEVICE AND REACTION DEVICE HAVING HOLLOW DEVICE
Document Type and Number:
Japanese Patent JP2004009274
Kind Code:
A
Abstract:

To easily and accurately manufacture a hollow device having a hollow part of a fine and complicated pattern of nm-μm units at a low cost.

A material 2 for a main body such as epoxy resin, etc. is hardened up to a degree in which the material 2 has self shape holding property to form a first device main body 12A. Copper foil (a base material 5 for a hollow part forming member) is supported by the first device main body 12A. The copper foil is etched by solvent after plotting resist 6 into a prescribed pattern on the copper foil by ink jet to form the hollow part forming member 3 having a prescribed pattern specified by the resist 6. After the hollow part forming member 3 is buried into the first device main body 12A by pressing, the hollow part forming member is removed to form a recessed part 14A for the hollow part 14 in the first device main body 12A. The hollow device 10 having the hollow part 14 is manufactured by adhering a second device main body 12B having a solid surface to the first device main body 12A.


Inventors:
TOMINAGA YASUSHI
NAKADA TAKAHIRO
YASUNAGA YUKARI
Application Number:
JP2002170182A
Publication Date:
January 15, 2004
Filing Date:
June 11, 2002
Export Citation:
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Assignee:
SUMITOMO BAKELITE CO
International Classes:
G01N37/00; B01J19/00; B81B1/00; B81C1/00; (IPC1-7): B81C1/00; G01N37/00
Attorney, Agent or Firm:
Shinichi Kikuchi
Toru Kikuchi