To attain both temporary crimping properties and repair properties in a method for manufacturing a mounting body for mounting an electronic member on a wiring board through an anisotropic conductive film.
The anisotropic conductive film 2, after it is temporarily crimped to a wiring board 1, is properly crimped with electronic components 3 arranged. The temporary crimping is carried out by being pressed at a temperature where the anisotropic conductive film 2 is not thermally hardened. The anisotropic conductive film 2 is to contain thermosetting resin components, thermoplastic resin components, rubber-based polymer components, and conductive particles, and that, the thermoplastic resin components contain low-glass-transition temperature thermoplastic resins with a glass transition temperature lower than a heating temperature at heating in the temporary crimping process, and high-glass-transition temperature thermoplastic resins with a glass transition temperature higher than a heating temperature at heating in the temporary crimping process.
| JPH06203642A | 1994-07-22 | |||
| JP2010102859A | 2010-05-06 | |||
| JP2008133411A | 2008-06-12 |
Seiji Iga
Toshiya Fujii
Nobuhiro Noguchi
Yusei Atsuya