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Patent Searching and Data


Title:
METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD INDUCTANCE ELEMENT
Document Type and Number:
Japanese Patent JPH10189378
Kind Code:
A
Abstract:

To provide a method for manufacturing a printed circuit board inductance element that reduces a packaging cost, by constituting a plurality of metal members in one piece and packaging them in one piece, preventing the packaging cost from increasing due to the increase in the number of turns, and increasing a packaging density with a simple configuration.

In a method for manufacturing a printed circuit board inductance element where both edges of a plurality of metal members 1 that are formed in U shape are inserted along a printed circuit board 2, and one edge part of one metal member 1 is connected to the other edge at the opposite side of the adjacent metal member 1 by a conductor pattern 3 on the substrate 2, a plurality of metal members 1 are constituted in one piece, the metal members 1 formed in one piece are inserted into the printed circuit board 2, and then each metal member 1 is separated.


Inventors:
YAMAGUCHI HIROYUKI
Application Number:
JP1996000350498
Publication Date:
July 21, 1998
Filing Date:
December 27, 1996
Export Citation:
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Assignee:
CANON KK
International Classes:
H01F41/04; H05K1/16; H05K3/30; (IPC1-7): H01F41/04
Attorney, Agent or Firm:
新部 興治 (外2名)