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Title:
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE BY USE OF ADHESIVE SHEET AND DICING TAPE
Document Type and Number:
Japanese Patent JP2017147293
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device, which is superior in dividability when dividing an adhesive film and a wafer into individual chips, which can prevent the adhesive film from sticking again and a chip from touching it, and can remove the deflection, and which is superior in position recognition after that and enables the satisfactory pick-up.SOLUTION: A method for manufacturing a semiconductor device by use of an adhesive sheet and a dicing tape in the form of a wafer-processing tape. The wafer-processing tape is composed of a laminate arranged by laminating a dicing tape to a semiconductor wafer through an adhesive sheet, which shrinks by heating after expansion. The dicing tape is 110% or more in elongation in a range of -15 to 10°C. By heating to 100°C or higher after extension in the range of -15 to 10°C so as to achieve an elongation of 105% or more, the wafer-processing tape shrinks to 80% or under in area; at this time, an adhesive sheet and a dicing tape which make the ratio of a quantity of shrinkage in TD direction (widthwise direction) and a quantity of shrinkage in MD direction (longitudinal direction) 1.2 or less are used.SELECTED DRAWING: Figure 4

Inventors:
UEDA ASAMI
OKUBO KEISUKE
IWANAGA YUKIHIRO
Application Number:
JP2016026804A
Publication Date:
August 24, 2017
Filing Date:
February 16, 2016
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
H01L21/301; B23K26/53; C09J7/00; C09J7/02; C09J201/00