To provide a method of manufacturing wiring board which can prevent the peel of a conductor pattern from a resin surface while the formation accuracy of a conductor pattern formed on the surface of resin layer is improved.
A wiring board is manufactured by forming a conductor pattern 14 by patterning a metal layer formed in a predetermined thickness in the sequence of non-electrolytic plating and electrolytic plating to the surface of a resin layer 12 composed of an electrical insulation resin mixed with mixing particles such as SiO2 particles. In this case, the conductor pattern forming surface of the resin layer is placed in contact with the solution of a hydrofluoric acid compound after plasma treatment on the conductor pattern forming surface of the resin layer, glass etching is performed to remove the mixing articles existing in the vicinity of the conductor pattern forming surface, and thereafter the metal layer in the predetermined thickness is formed by conducting non- electrolytic plating and electrolytic plating to the conductor pattern forming surface of the resin layer where surface roughness Rmax after the pre-process is performed thereto is 0.2 μm or less.
TANAKA SHUICHI
KOBAYASHI KAZUKI
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