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Patent Searching and Data


Title:
METHOD FOR MANUFACTURING WIRING BOARD
Document Type and Number:
Japanese Patent JP2012028545
Kind Code:
A
Abstract:

To provide a method for manufacturing a wiring board in which a hole having a relatively small inner diameter can be filled with a conductive paste, a plurality of holes having small pitches between adjacent holes can be filled with the conductive paste, and a connection between a surface and a rear surface of a substrate body is surely established through a via conductor consisting of the paste.

The method for manufacturing the wiring board comprises a filling step for filling a conductive paste p into a plurality of holes 4 formed along a thickness direction of an insulating layer 1 and having a length h in an axial direction more than 5 times of the inner diameter. The filling step for filling the conductive paste p comprises a step for contacting a mask plate 5 consisting of a thin plate part 8 having perforations 9 corresponding to forming positions of holes 4 and which are the same number as the number of holes 4, and a thickness t of 30 to 100 μm, and a thick plate part 6 surrounding the thin plate part 8, with the surface or the rear surface of the insulating layer 1; and a filling step for press-fitting and filling the conductive paste p into the holes 4 conducting with perforations 9 via a plurality of perforations 9 in the mask plate 5.


Inventors:
NAGAYA YOSHIAKI
NAKAGAWA HISATO
MORIKAWA KAZUKO
IWATA MUNEYUKI
Application Number:
JP2010000165515
Publication Date:
February 09, 2012
Filing Date:
July 23, 2010
Export Citation:
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Assignee:
NGK SPARK PLUG CO
International Classes:
H05K3/40; H05K1/11; H05K3/46
Attorney, Agent or Firm:
鈴木 学