Title:
METHOD OF MANUFACTURING WIRING BOARD
Document Type and Number:
Japanese Patent JP2021005646
Kind Code:
A
Abstract:
To provide a method of manufacturing a wiring board, with which the adhesion between a wiring layer and an insulation layer can be improved.SOLUTION: The present method of manufacturing a wiring board includes the steps of: forming a wiring layer on a first insulation layer; forming irregularities by roughening the surface of the wiring layer, the surface being not in contact with the first insulation layer; forming an adhesion enhancement coat on the irregularities; partially removing the adhesion enhancement coat with the use of an acidic solution; and forming, on the first insulation layer, a second insulation layer covering the wiring layer.SELECTED DRAWING: Figure 3
Inventors:
SHIMOHIRA TOMOYUKI
KONDO HITOSHI
KONDO HITOSHI
Application Number:
JP2019118956A
Publication Date:
January 14, 2021
Filing Date:
June 26, 2019
Export Citation:
Assignee:
SHINKO ELECTRIC IND CO
International Classes:
H05K3/38; B32B15/08
Domestic Patent References:
| JP2004343004A | 2004-12-02 | |||
| JP2013119240A | 2013-06-17 | |||
| JP2003298230A | 2003-10-17 | |||
| JP2011228632A | 2011-11-10 |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Tadahiko Ito