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Patent Searching and Data


Title:
METHOD FOR MANUFACTURING WOOD FIBER BOARD
Document Type and Number:
Japanese Patent JP2002052515
Kind Code:
A
Abstract:

To manufacture a wood fiber board which does not contain formaldehyde, has excellent water resistance, bending strength and peel strength and presents a good appearance at a moderate price.

In the case where the wood fiber board is manufactured by a dry method, by adding a polyol having ≥2 pieces of hydroxyl groups to wood chips in a steaming and boiling process, the polyol is dispersed uniformly over the whole of the wood chips. Then, after a process wherein the wood chips are fibrillated, by adding an isocyate based compound to the fibrillated wood fiber, it is allowed to react with the polyol having ≥2 pieces of hydroxyl groups to develop adhesion action wherein the wood fiber is uniformly bonded even though an additional amount of the isocyanate based compound is little. The wood fiber board wherein a good appearance is presented without generating a resin spot and the like, and excellent physical properties are provided, is obtained.


Inventors:
HONDA TAKAHISA
Application Number:
JP2000240737A
Publication Date:
February 19, 2002
Filing Date:
August 09, 2000
Export Citation:
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Assignee:
DAIKEN TRADE & INDUSTRY
International Classes:
B27N1/00; B27N3/04; B27N3/08; (IPC1-7): B27N1/00; B27N3/04; B27N3/08
Attorney, Agent or Firm:
Takuya Yamamoto