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Title:
METHOD FOR MOLDING OPTICAL DISK SUBSTRATE, MOLD, AND MOLDING MACHINE
Document Type and Number:
Japanese Patent JPH0919952
Kind Code:
A
Abstract:

To prevent the defective peeling and transfer at demolding when an optical disk substrate is molded by an injection-compression molding method.

A movable mold 2 is moved toward a fixed mold 1, after a cavity, which was formed by closing a parting surface 9, being filled with resin, a movable mirror block part 10 is moved to the side of the fixed mold 1 and compressed, and an optical disk substrate having a pit which followed a stamper and a guide groove is compression-molded. At demolding after the passage of a cooling period, in a period until the movable mold 2 begins to move, prescribed pressure is maintained to keep the thickness of the cavity constant, or the movable mold 2 itself is made to have structure to receive compressive force, and with the thickness of the cavity kept constant under the compressive pressure, the mold opening is started, and then by eliminating the compressive pressure at once, the optical disk substrate is removed from the mold uniformly.


Inventors:
UEDA KEIJI
Application Number:
JP18685595A
Publication Date:
January 21, 1997
Filing Date:
July 24, 1995
Export Citation:
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Assignee:
RICOH KK
International Classes:
B29C45/26; B29C45/56; B29D17/00; G11B7/26; B29L17/00; (IPC1-7): B29C45/56; B29D17/00; G11B7/26
Attorney, Agent or Firm:
Akinori Takano (1 person outside)