Title:
METHOD FOR PLATING ALUMINUM-BASED POWDERY ALLOY
Document Type and Number:
Japanese Patent JPH03294482
Kind Code:
A
Abstract:
PURPOSE: To simplify pretreatment for plating and to enable stable plating on an Al-based powdery alloy by carrying out electroless plating in pretreatment without carrying out zincate treatment.
CONSTITUTION: When an Al alloy is electroplated, oil and other soil on the alloy are removed with trichlene and an oxide film on the alloy is removed with sodium carbonate. Silicon contained in the alloy in plenty is dissolved in a hydrofluoric acid-nitric acid mixed soln., the alloy is subjected to electrolysis at about -4V voltage in an electroless Ni plating soln. for about 0.5-1min and then electroless plating is carried out as usual. Pretreatment enabling stable plating on the Al-based powdery alloy can be carried out.
Inventors:
TAKIMOTO ATSUSHI
Application Number:
JP9863190A
Publication Date:
December 25, 1991
Filing Date:
April 13, 1990
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
C23C18/32; C23C18/31; C25D5/30; C25D7/00; (IPC1-7): C23C18/31; C23C18/32; C25D5/30; C25D7/00
Domestic Patent References:
| JPH01290790A | 1989-11-22 |
Attorney, Agent or Firm:
Hiroshi Murakami (1 outside)