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Title:
METHOD FOR PREPARING POLISHING SLURRY
Document Type and Number:
Japanese Patent JP2002305166
Kind Code:
A
Abstract:

To provide a slurry capable of reducing scratches on the surface of a wafer after CMP polishing, and a method for preparing the polishing slurry.

The method for preparing the slurry includes a process of adding abrasive grains into an aqueous medium at 23°C or lower for dispersing them. The method also may include a process for storing the dispersed slurry in a cooling tank.


Inventors:
YOSHIDA KOICHI
ITAI YASUYUKI
FUKUDA KEIJI
HABA SHINICHI
OTA KEIJI
Application Number:
JP2001107852A
Publication Date:
October 18, 2002
Filing Date:
April 05, 2001
Export Citation:
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Assignee:
RODEL NITTA CO
International Classes:
B24B57/02; B24B37/00; C09K3/14; H01L21/304; (IPC1-7): H01L21/304; B24B37/00; B24B57/02; C09K3/14
Domestic Patent References:
JPH07254579A1995-10-03
JPS6268276A1987-03-28
JPH06761A1994-01-11
JPH04216627A1992-08-06
Foreign References:
WO1999065592A11999-12-23
Attorney, Agent or Firm:
Shusaku Yamamoto



 
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