To provide a method for producing an electrical solid-state device, allowing thinning and a cut to a large-size glass substrate after forming a function layer even without sticking a large-size glass substrate on a large-size glass substrate to form a panel, and allowing easy collection of a substrate for the electrical solid-state device obtained by cutting the large-size glass substrate.

One face 200a of the large-size glass substrate 200 formed with the function layer 29 is etched in a state that the one face 200a is covered with a one face side protective layer 280 to thin the large-size glass substrate 200, and thereafter the large-size glass substrate 200 is cut. The one face side protective layer 280 includes: a first protective layer 281 covering an effective area 200e in a state that a peripheral area 200f surrounding the effective area 200e on an outer circumference side is avoided; and a second protective layer 282 covering the first protective layer 281 and the peripheral area 200f, stuck to the peripheral area 200f. The first protective layer 281 has weak adhesiveness to the large-size glass substrate 200.