To provide a recycling method of continuously and effectively peeling nickel from the scrap of copper or a copper alloy plated with nickel without using an expensive peeling liquid having the short life or also without etching the copper or copper alloy after the peeling operation, and using the scrap of the copper or copper alloy from which a plated nickel film has been peeled, as a raw material for producing copper or a copper alloy.
The recycling method includes: immersing the scrap of the copper or copper alloy having the surface plated with nickel into a treatment tank which contains an anode and a cathode for causing an electrolytic reaction, and accommodates an iron sulfate solution therein; peeling the plated nickel film by a chemical reaction of 2Fe3++Ni→2Fe2++Ni2+; continuously peeling the plated nickel film by regenerating consumed Fe3+ while using an electrolytic reaction of Fe2+→Fe3++e-; and using the resultant copper or copper alloy as the raw material for producing copper or copper alloy. The recycling method shows a remarkable effect when employing a peeling liquid which contains 50-600 g/l of sulfuric acid and 1-50 g/l of Fe, and employing a cathode current of 5-100 A/dm2 and an anode current of 0.01-10 A/dm2 in an electrolytic regeneration operation.
ISHIKAWA SEIICHI
KUBOTA KENJI
JP2001123280A | 2001-05-08 | |||
JPS59112827A | 1984-06-29 | |||
JPS5028425A | 1975-03-24 | |||
JPS49110051U | 1974-09-19 | |||
JPS526349A | 1977-01-18 |