Title:
A METHOD OF REMOVING CLOSED SHAPE FROM BRITTLE MATERIAL SUBSTRATE USING BURST OF ULTRA HIGH-SPEED LASER PULSE
Document Type and Number:
Japanese Patent JP2015129076
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an improved method of removing a closed shape (an internal shape) cut from a brittle material substrate.SOLUTION: A method of mechanically removing a closed shape 2 from a brittle transparent substrate 1 includes a step of drilling an orifice pattern in the substrate 1 using a burst of an ultra high speed laser pulse. The orifice is formed by photoacoustic compression machining and either completely or partially penetrates the substrate 1. A scribe line 21S consisting of the separated orifices of the transparent substrate 1 forms a closed pattern 2 on the substrate 1. A method of removing the closed shape pattern 2 from the transparent substrate 1 utilizes a heat source to a region of the scribe line 21S consisting of the orifices.
Inventors:
S ABBAS HOSSEINI
Application Number:
JP2014230987A
Publication Date:
July 16, 2015
Filing Date:
November 13, 2014
Export Citation:
Assignee:
ROFIN SINAR TECHNOLOGIES INC
International Classes:
C03B33/09; B23K26/382; B23K26/55; B28D5/00; C03B33/023
Domestic Patent References:
| JP2013536081A | 2013-09-19 |
Attorney, Agent or Firm:
Takashi Tsuno
Kato coming
Takeharu Hirabayashi
Kato coming
Takeharu Hirabayashi