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Patent Searching and Data


Title:
METHOD FOR REMOVING WATERPROOF STRUCTURE LAYER OF ROAD, AND CUTTING MACHINE AND POLISHING MACHINE USED FOR THE METHOD
Document Type and Number:
Japanese Patent JP2017164844
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method for removing a waterproof structure layer of a road that can efficiently remove a synthetic resin waterproof structure layer formed on a surface of a concrete floor slab, and a cutting machine and a polishing machine used for the method.SOLUTION: A waterproof structure layer remaining after the cutting by a large-sized cutting machine is cut by a cutting machine of the present invention, and remaining parts are polished by a polishing machine of the present invention and removed. A polishing part 40 of the polishing machine is provided with a first rotation body 45 and second rotation bodies 41-44, and a first polishing member 51 and a second polishing member 52 are attached to each second rotation body on a concentric circle. A large diameter diamond grain with large polishing power is fixed to a binding agent of the first polishing member 51 while a small diameter diamond grain suitable for abrasive finishing is fixed to a binding agent of the second polishing member 52 with a degree of hardness higher than that of the first polishing member 51.SELECTED DRAWING: Figure 5

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Inventors:
HIBI HIROMI
Application Number:
JP2016051949A
Publication Date:
September 21, 2017
Filing Date:
March 16, 2016
Export Citation:
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Assignee:
MARUHOU CO LTD
International Classes:
B24B27/00; B24B1/00; B24B7/18; B26D3/28; E01C23/00
Domestic Patent References:
JPS5164735A1976-06-04
JPH11247129A1999-09-14
JP2001040884A2001-02-13
JPS4884434A1973-11-09
JP2000317803A2000-11-21
Foreign References:
WO1999041456A11999-08-19
US20120270483A12012-10-25
US8272924B22012-09-25
US20060172667A12006-08-03
Attorney, Agent or Firm:
熊崎 陽一