To provide a method for separating flux and solder, by which flux and solder can be surely separated without requiring any complex structure, and an apparatus for recycling a solder-containing material using the method.
The apparatus 10 for recycling a solder-containing material is equipped with: a heating oven 20 that heats the solder-containing material by a heater 22; a non-illustrated inversion means for inverting the heating oven 20; a net 32 located below the heating oven 20; and a recovery container 36 located below the net. The solder-containing material is heated by the heating oven 20 and, taking advantage of a difference in specific gravity, separated into an upper layer comprising flux 40 and a lower layer comprising solder 42. The heating oven 20 is cooled and, taking advantage of a difference in melting point, the flux 40 is kept in a molten state while the solder 42 is solidified. Then, the heating oven 20 is inverted so as to drop the flux 40 and the solder 42 onto the net 32 and the recovery container 36. The solder 42 is caught by the net 32, while the flux 40 is recovered in the recovery container 36 located below the net 32.
MAEDA KENSUKE
MAKITA MUTSU
NAKANO FUTOSHI
