Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
METHOD AND SYSTEM FOR PICKING UP SEMICONDUCTOR CHIP UNIT FROM WAFER
Document Type and Number:
Japanese Patent JP2000138277
Kind Code:
A
Abstract:

To provide a method for picking up a semiconductor chip unit from a wafer with safety and reliability, when a semiconductor package is manufactured, and to provide a pick-up system used for the method.

A method comprises the steps of setting a sawed wafer, including many semiconductor chip units fixedly stuck to a ring-shaped frame with adhesive tapes 2, 2' between ejecting units using a jet fluid, causing the semiconductor chip units stuck to the adhesive tapes preliminarily partially to separate by the ejecting units or reducing an adhesive force, and vacuum chucking and carrying the semiconductor chip units with a vacuum unit.


Inventors:
KIN SHOGAKU
KIN TOSEKI
Application Number:
JP1999000002632
Publication Date:
May 16, 2000
Filing Date:
January 08, 1999
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
ANAM SEMICONDUCTOR INC
International Classes:
H01L21/67; H01L21/50; H01L21/68; (IPC1-7): H01L21/68
Attorney, Agent or Firm:
瀬谷 徹 (外1名)