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Patent Searching and Data


Title:
MICRO PARALLEL SEAM JOINING DEVICE
Document Type and Number:
Japanese Patent JPH0631458
Kind Code:
A
Abstract:

PURPOSE: To extend an application range of the micro parallel seam joining device by using by selecting either one electrode of electrode holding arms in a couple of tapered roller electrodes provided deflectively in the direction to orthogonally cross the periphery of a cap.

CONSTITUTION: The micro parallel seam joining device of a vessel to store a semiconductor device and the cap is provided with a couple of electrode holding arms 30 capable of relatively moving along the periphery of the cap 6 and the couple of tapered roller electrodes 32 and 34 held freely rotatably thereby and deflected in the direction to orthogonally cross the periphery of the cap. Consequently, when the cap of a rectangle having a greatly different ratio of the lengths of length and width is subjected to seam joining, the moving distance of the electrode holding arms 30 is reduced to increase the processing speed, the device is miniaturized and further, the distance between the electrodes which can be met with one device can be drastically extended.


Inventors:
TAKEUCHI MASATO
Application Number:
JP1992000207037
Publication Date:
February 08, 1994
Filing Date:
July 13, 1992
Export Citation:
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Assignee:
NIPPON AVIONICS CO LTD
International Classes:
B23K11/00; H01L23/02; (IPC1-7): B23K11/00; H01L23/02
Attorney, Agent or Firm:
山田 文雄 (外1名)