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Title:
MICROWAVE HEATING TREATMENT APPARATUS, AND HEATING TREATMENT METHOD
Document Type and Number:
Japanese Patent JP2014056806
Kind Code:
A
Abstract:

To provide a microwave heating treatment apparatus capable of performing uniform treatment on an object to be treated, and to provide a heating treatment method.

In a microwave heating treatment apparatus 1, a wafer W is supported by a plurality of support pins 16 during anneal treatment, and the wafer W is rotated horizontally at a predetermined speed by driving a rotation drive section 17. The plurality of support pins 16 are lifted and lowered vertically together with a shaft 14 by driving a lift drive section 18, thereby variably adjusting a height position of the wafer W. Microwaves are generated by applying a voltage from a high voltage power source section 40 to a magnetron 31, and introduced through a waveguide 32 and a transmission window 33 to a space at an upper side of the wafer W rotating within a treatment vessel 2. A surface of the rotating wafer W is irradiated with microwaves introduced into the treatment vessel 2, and the wafer W is promptly heated by electromagnetic wave heating such as Joule heating, magnetic heating, and induction heating.


Inventors:
TANAKA KIYOSHI
IKEDA TARO
KABE YOSHIRO
SHIMOMURA KOJI
HONG SEOKHYOUNG
YAMASHITA JUN
BAN MASAKAZU
KADOTA TAICHI
MAENISHI MASAYOSHI
YAMAZAKI RYOJI
Application Number:
JP2012000261338
Publication Date:
March 27, 2014
Filing Date:
November 29, 2012
Export Citation:
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Assignee:
TOKYO ELECTRON LTD
International Classes:
H05B6/72; F27B17/00; F27D11/12; H01L21/268; H05B6/78
Attorney, Agent or Firm:
渡邊 和浩
星宮 勝美
城澤 達哉



 
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