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Title:
MODIFIED EPOXY RESIN COMPOSITION FOR PREPREG, PREPREG AND LAMINATED BOARD USING THE SAME
Document Type and Number:
Japanese Patent JP2003073449
Kind Code:
A
Abstract:

To provide an epoxy resin composition for a prepreg, which gives a prepreg having an excellent moldability and also a laminated board which exhibits excellent mechanical properties by curing.

The modified epoxy resin composition contains a modified epoxy resin obtained by reacting (A) a bisphenol type epoxy resin with (B) primary or secondary aliphatic amines and further optionally (C) other amines, (D) a 8-22C fatty acid and/or (E) isocyantes, and contains a non-modified epoxy resin. The prepreg and laminated board obtained from the composition are provided.


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Inventors:
NAKAMURA NARUHIRO
KOJIMA YASUSHI
ADACHI HIROSHI
KAWAGUCHI KENICHI
Application Number:
JP2001264087A
Publication Date:
March 12, 2003
Filing Date:
August 31, 2001
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08J5/24; B32B15/08; C08G59/14; C08L63/00; (IPC1-7): C08G59/14; B32B15/08; C08J5/24; C08L63/00
Domestic Patent References:
JPS6143617A1986-03-03
JPH08134403A1996-05-28
JPH02212568A1990-08-23
JPH11100431A1999-04-13
JPH09136943A1997-05-27
JPH0940879A1997-02-10
JPS6317938A1988-01-25
Attorney, Agent or Firm:
Hajime Tsukuni (1 person outside)



 
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