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Title:
MOISTURE-PROOF STRUCTURE OF THIN FILM EL DEVICE
Document Type and Number:
Japanese Patent JPH03187188
Kind Code:
A
Abstract:

PURPOSE: To obtain a moisture proof structure for permitting moisture-proofing by baking and solidifying an application type inorganic material with a moisture absorbing material blended in a recess of a glass cap opposite to a thin film EL device.

CONSTITUTION: A thin film EL device A exhibiting EL emission is protected against moisture by using a glass cap 7 whose cross section is an approximate recess. At this time an application type inorganic material 10 with a moisture absorbing material 9 blended is baked and solidified in a recess 8 of the glass cap 7 opposite to the thin film EL device. That is, blended solution with the moisture absorbing material 9 blended into the application type inorganic mate rial 10 is baked and solidified in the recess 8. Thus moisture which has entered the glass cap during an assembly process is absorbed by the moisture absorbing material so that the thin film EL device is free from deterioration in characteristics for a long time.


Inventors:
NAGUMO HIROCHIKA
Application Number:
JP32593289A
Publication Date:
August 15, 1991
Filing Date:
December 18, 1989
Export Citation:
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Assignee:
KENWOOD CORP
International Classes:
H05B33/04; (IPC1-7): H05B33/04



 
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