Title:
MOLD ASSEMBLY FOR RESIN SEALING MOLDING OF ELECTRONIC PART
Document Type and Number:
Japanese Patent JP2003053788
Kind Code:
A
Abstract:
To efficiently clean the mold surface of a mold (three-piece type) mounted on a mold assembly for the resin sealing molding of an electronic part.
In the mold assembly (three-piece type) for the resin sealing molding of the electronic part loaded with a mold consisting of an upper mold 2, an intermediate mold 5 and a lower mold 4, the intermediate mold 5 is constituted so as to be hung from the lateral positions of the upper mold 2 in an upper fixed template 1 by hanging members 8. Accordingly, the hanging members 8 do not obstruct cleaning mechanisms 15 and 16 for cleaning the respective mold surfaces of the molds to make it possible to efficiently clean the respective mold surfaces of the molds.
Inventors:
TAMURA KOJI
Application Number:
JP2001243335A
Publication Date:
February 26, 2003
Filing Date:
August 10, 2001
Export Citation:
Assignee:
TOWA CORP
International Classes:
B29C45/26; B29C33/72; B29C45/02; B29C45/14; H01L21/56; B29L31/34; (IPC1-7): B29C45/26; B29C33/72; B29C45/14; H01L21/56
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