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Patent Searching and Data


Title:
MOLD FOR FOAM MOLDING
Document Type and Number:
Japanese Patent JPS57207036
Kind Code:
A
Abstract:

PURPOSE: To obtain the titled mold wherein uneven distribution of high-frequency energy is lessened, by making a part of mold outer surface member which will be in contact with a part of less high-frequency loss with a low dielectric loss, and supplying high-frequency energy through this dielectric.

CONSTITUTION: The insides of side sections 5, 6 of a foaming mold and an upper section 7 having an injection head 12 in communication with foamable resin feeding tanks 9, 10 are provided with a box space 3 comprising a metallic outer box 1 and a thin synthetic resin inner box 2, and an inner mold 18 made of a material having a low dielectric loss is arranged in contact with the inner box 2. Metallic rotating vanes 21 for scattering high-frequency energy to be fed to the foamable resin in the space 3 are provided within an inner space 19 made up of the inner mold 18 and a bottom 4 having a waveguide 20 in communication with a high-frequency energy generating apparatus 14.


Inventors:
TSUKAHARA MASAYUKI
KODERA YOSHIE
KANEKO KAZUO
Application Number:
JP9230681A
Publication Date:
December 18, 1982
Filing Date:
June 17, 1981
Export Citation:
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Assignee:
HITACHI LTD
International Classes:
B29B7/00; B29C39/00; B29C39/10; B29C39/26; B29C44/34; B29C33/06; (IPC1-7): B29D27/02