Title:
MOLD FOR IMPRINTING AND FORMING METHOD OF MICROSTRUCTURE
Document Type and Number:
Japanese Patent JP2013180508
Kind Code:
A
Abstract:
To provide a mold for imprinting which can stably be peeled off from a transfer material, and a forming method of a microstructure using the mold.
A mold 11 for imprinting is located on a main face 13 of a base material 12 so that a plurality of regions III, II, I, II' and III' having irregular structures may adjoin along specified directions, and stress necessary for peeling off a transfer material at each of the plurality of regions III, II, I, II' and III' is set so as to have a tendency to increase toward the specified region I from the regions III, III' located at both ends of the specified directions.
Inventors:
ARITSUKA YUKI
Application Number:
JP2012046234A
Publication Date:
September 12, 2013
Filing Date:
March 02, 2012
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
B29C33/42; H01L21/027; B29C59/02
Domestic Patent References:
| JP2011116032A | 2011-06-16 | |||
| JP2008093970A | 2008-04-24 | |||
| JP2010225683A | 2010-10-07 |
Attorney, Agent or Firm:
Junzo Yoneda
Hideo Sarada
Masataka Ota
Hideo Sarada
Masataka Ota
Previous Patent: APPARATUS AND METHOD FOR MANUFACTURING EMBOSSED FILM
Next Patent: MOLD APPARATUS FOR INJECTION MOLDING
Next Patent: MOLD APPARATUS FOR INJECTION MOLDING