Title:
MOLD MACHINING METHOD OF WIRE
Document Type and Number:
Japanese Patent JPS58202718
Kind Code:
A
Abstract:
PURPOSE: To efficiently machine a powder molded material of sintered alloy, cermet and ceramics, by using a wire, in which diamond in suitable grain size is coated to the surface of a metallic wire, as a tool.
CONSTITUTION: Diamond grains are coated to the surface of a 0.05W0.5mm diameter strand wire to obtain a wire tool. Diamond to be coated is preferable in about 8W60μ size, and this size may be optionally selected in accordance with a kind, machined shape and accuracy of a machined material. The machined material is worked at a machining speed of 102W104mm2/min while allowing said wire tool to pass through a solvent. In this way, a break is never generated in the machined material capable of obtaining good machining efficiency.
Inventors:
MARUYAMA MASAO
MIYAKE MASAYA
SHIYOU TADAMASA
MIYAKE MASAYA
SHIYOU TADAMASA
Application Number:
JP8450782A
Publication Date:
November 26, 1983
Filing Date:
May 18, 1982
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES
International Classes:
B24B27/06; B23D61/18; (IPC1-7): B23D61/18
Attorney, Agent or Firm:
Tetsuji Ueshiro