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Title:
MOLD AND METHOD FOR MOLDING SUBSTRATE
Document Type and Number:
Japanese Patent JPH07205200
Kind Code:
A
Abstract:

PURPOSE: To prevent the generation of bit shift and double transfer by sucking the rear surface of a stamper from a mold to hold the surface and peripheral end surface of the stamper to a non-contact state with respect to the mold and setting the part facing to the cavity of the mold prescribing the outer peripheral side surface of a substrate to be molded to a specfic angle with respect to a stamper attaching surface.

CONSTITUTION: The rear surface of a stamper 14 is sucked by the suction hole 13 provided to a mold 11 to fix the stamper 14 to the mold 11 in a close contact state. Outer and inner periphery holders 15, 16 are provided to the outer and inner peripheral parts of the stamper 14 but not brought into contact with the surface and peripheral end surface of the stamper 14 to be held to a non-contact state. Further, the inner surface 16a of the holder 16, in other words, the part facing to the cavity of the mold prescribing the outer peripheral surface of a substrate is set to an angle ±3°C from perpendicularity with respect to the attaching surface of the stamper 14. The operation of air supplied from the slit 25 on the side opposite to the stamper is made simultaneous or delayed with respect to the operation of air supplied from the slit 26 on the side of the stamper.


Inventors:
TAMURA TAKANORI
YOKOTA SHOJI
Application Number:
JP166494A
Publication Date:
August 08, 1995
Filing Date:
January 12, 1994
Export Citation:
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Assignee:
MITSUBISHI CHEM CORP
International Classes:
B29C45/26; B29C45/43; B29D17/00; G11B7/26; B29L17/00; (IPC1-7): B29C45/26; B29C45/43; B29D17/00; G11B7/26
Attorney, Agent or Firm:
Hasegawa Moji