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Patent Searching and Data


Title:
MOLD RELEASE FILM
Document Type and Number:
Japanese Patent JP2010052202
Kind Code:
A
Abstract:

To provide a mold release film which improves the releasability from a molding mold or a molding resin, and eliminates the possibility of causing contamination of the molding mold.

The mold release film, which is to be interposed between the molding mold and the mold resin when a molded article is molded by filling the molding mold with the mold resin, is obtained by preparing a resin composition by mixing 25-400 pts.wt. of a polyethylene-based resin with 100 pts.wt. of an ethylene-based copolymer rubber, molding the film by extrusion using the resin composition, and then crosslinking the mold release film by irradiating the film with an ionizing radiation. The ethylene-based copolymer rubber is a rubber having Mooney viscosity ML1+4 (125C) of 10-100, an ethylene content of 40-90 wt.%, and a nonconjugated diene content of 0.5-8.0 wt.%, and the polyethylene-based resin is a resin having density of 0.855-0.925 g/cm3, and MFR (190C/2.16 kgf) of 0.5-10.0 g/10 min.


Inventors:
OTE MICHIMASA
SUZUKI KAZUHIRO
Application Number:
JP2008000217733
Publication Date:
March 11, 2010
Filing Date:
August 27, 2008
Export Citation:
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Assignee:
SHINETSU POLYMER CO
International Classes:
B29C33/68
Domestic Patent References:
JPH0655546A1994-03-01
JPH0748482A1995-02-21
JPH0912795A1997-01-14
JP2005146137A2005-06-09
JP2006299065A2006-11-02
JPH05147168A1993-06-15
JPH1076532A1998-03-24
JPH10130565A1998-05-19
JPH0655546A1994-03-01
JPH0748482A1995-02-21
JPH0912795A1997-01-14
JP2005146137A2005-06-09
JP2006299065A2006-11-02
JPH05147168A1993-06-15
JPH1076532A1998-03-24
JPH10130565A1998-05-19
Attorney, Agent or Firm:
藤本 英介
神田 正義
宮尾 明茂