Title:
MOLD RELEASE FILM
Document Type and Number:
Japanese Patent JP2011212848
Kind Code:
A
Abstract:
To provide a mold release film that has embedding characteristics better than those of the conventional PBT mold release film while preventing tight adhesion between a circuit exposure film of a mold release layer and a CL (cover layer) film and between the mold release layers when the CL film is adhered to the circuit exposure film.
The mold release film 100 includes the mold release layer 110 as a surface layer on at least one side thereof. It does not matter if the mold release film is formed from only the mold release layer. The mold release layer is formed from a resin based on a polyether ester block copolymer. The polyether ester block copolymer comprises a polyester segment and a polyether segment.
Inventors:
TANIGUCHI YUTO
Application Number:
JP2010080324A
Publication Date:
October 27, 2011
Filing Date:
March 31, 2010
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
B32B27/36; B32B27/00; C08G65/02; H05K3/28
Attorney, Agent or Firm:
Patent Business Corporation Claire Patent Office